Study on damping capacity and dynamic Young's modulus of aluminium matrix composite reinforced with SiC particles

ISSN: 0870-8312

Ciência & Tecnologia dos Materiais is the official journal of SPM, the Portuguese Society of Materials (Sociedade Portuguesa de Materiais), providing a forum for publishing peer-reviewed papers related to both fundamentals of materials science and technological application of engineering materials. The scope of the journal covers a wide range of topics in materials science that are of interest to the SPM, encompassing electrochemistry, corrosion and protection of materials, extractive metallurgy and recycling, electronic and optoelectronic materials, biomaterials, forest materials, polymeric and composite materials, foundry, heat treatment and surface engineering, tribology, and fracture. Science and Technology of Materials welcomes contributions in the form of original research papers, review articles and technical notes reporting advances on those fields, emphasizing new materials, new products and devices, and new technologies.

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The development of high damping materials for noise reduction and attenuation of vibration on structural applications, such as automotive and aerospace industries, has been investigated. This experimental study is concerned with the damping capacity (tan delta) and dynamic Young's modulus (|E*|) of Silicon carbide (SiC) reinforced aluminium (Al) matrix composite. AlSi-SiCp composite was produced by hot pressing technique. Damping capacity and dynamic Young's modulus of composite and unreinforced AlSi alloy were studied using a dynamic mechanical analyser (DMA), over a temperature range of room temperature-400°C (during heating and cooling phases), at 1 and 20Hz. AlSi-SiCp composite showed higher damping capacity and dynamic Young's modulus than the AlSi unreinforced alloy. Furthermore, damping capacity was found to increase with temperature, while modulus decreases. The possible damping mechanisms are presented and discussed.

Keywords:

Aluminium

SiCp

metal matrix composites (MMCs)

damping capacity

dynamic Young's modulus

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References

[1]

Y. Zhang, N. Ma, X. Li, H. Wang.

Mater. Des., 29 (2008), pp. 1057

[2]

J. Zhang, R.J. Perez, E.J. Lavernia.

J. Mater. Sci., 28 (1993), pp. 2395

[3]

M. Colakoglu.

J. Theor. Appl. Mech., 42 (2004), pp. 95

[4]

Y. Zhang, N. Ma, H. Wang, Y. Le, X. Li.

Mater. Des., 28 (2007), pp. 628

[5]

P.K. Rohatgi, D. Nath, S.S. Singh, B.N. Keshavaram.

J. Mater. Sci., 29 (1994), pp. 5975

[6]

E.J. Lavernia, R.J. Perez, J. Zhang.

Metall. Mater. Trans. A, 26 (1995), pp. 2803

[7]

J. Gu, X. Zhang, M. Gu, X. Wang.

J. Alloys Compd., 372 (2004), pp. 304

[8]

J. Hu, X.F. Wang, S.W. Tang.

Compos. Sci. Technol., 68 (2008), pp. 2297

[9]

C. Wang, Z. Zhu.

Scr. Mater, 38 (1998), pp. 1739

[10]

G. Miranda, M. Buciumeanu, O. Carvalho, D. Soares, F.S. Silva.

Composites.

Part B: Engineering, 69 (2015), pp. 101

[11]

F.S. Silva.

Eng. Failure Anal., 13 (2006), pp. 480

[12]

G. Miranda, M. Buciumeanu, S. Madeira, O. Carvalho, D. Soares, F.S. Silva.

Composites.

Part B: Engineering, 74 (2015), pp. 153

[13]

C.S. Kang, K. Maeda, K.J. Wang, K. Wakashima.

Acta Mater, 46 (1998), pp. 1209

[14]

D.S. Prasad, C. Shoba, K.R. Varma.

J. Eng. Sci. Technol. Rev., 18 (2015), pp. 674

[15]

S. Amirkhanlou, B. Niroumand.

Mater. Des., 32 (2011), pp. 1895

[16]

A. Vincent, C. Girard, G. Lormand, X. Zhou, R. Fougères.

Mater. Sci. Eng., A, 164 (1993), pp. 327

[17]

J. Zhang, R. Perez, E.J. Lavernia.

J. Mater. Sci., 28 (1993), pp. 2395

[18]

G.S. Thompson, PhD thesis, Lehigh University, Bethlehem, Pa, USA, 2001.

[19]

R.I. Kheder, G.S. Marahleh, D.M.K. Al-Jamea.

Jord. J. Mech. Ind. Eng., 5 (2011), pp. 533

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